Testing of paper and board - Determination of the residue on ignition
Edition 2020-08

Particle size analysis - Size analysis by air classification - Fundamentals
Edition 2016-10

Testing of pigments - Determination of fines content and of loss in mass by abrasion of pelletized carbon black pigments
Edition 2023-12

Aerospace - Testing of thermosetting resin systems with and without reinforcement - DSC method
Edition 1999-03

Paper, board and pulps - Vocabulary
Edition 2017-09

Vibration measuring instrumentation - Fundamental requirements and verification
Edition 1996-12

Gas analysis - Measurement programs and data evaluation procedures for gas chromatography and other comparison methods; only on CD-ROM
Edition 2010-09

Chlorinators for water treatment - Technical requirements for equipment, installation and operation
Edition 2020-01

Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ) (IEC 60191-6-20:2010); German version EN 60191-6-20:2010
Edition 2011-03

Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP) (IEC 60191-6-21:2010); German version EN 60191-6-21:2010
Edition 2011-03