Connectors for frequencies below 3 MHz for use with printed boards. Part 9: Two-part connectors for printed boards, backpanels and cable connectors, basic grid of 2,54 mm (0,1 in)
Edition 1998-01

Connectors for frequencies below 3 MHz for use with printed boards. Part 12: Detail specification for dimensions, general requirements and tests for a range of sockets designed for use with integrated circuits
Edition 1998-01

Mechanical structures for electronic equipment practices. Part 2-3: Sectional specification - Interface co-ordination dimensions for the 25 mm equipment practice - Extended detail specification - Dimensions for subracks, chassis, backplanes, front
Edition 2006-07

Plasma display panels - Part 2-5: Measuring methods - Acoustic noise
Edition 2012-08

Fibre optic active components and devices - Package and interface standards - Part 16: Transmitter and receiver components for use with LC connector interface (IEC 62148-16:2009) (german version)
Edition 2010-08-01

Integrated circuits - Measurement of electromagnetic emissions - Part 8: Measurement of radiated emissions - IC stripline method (IEC 61967-8:2011) (german version)
Edition 2012-05-01

Fixed capacitors for use in electronic equipment - Part 22: Sectional specification - Fixed surface mount multilayer capacitors of ceramic dielectric, Class 2 (( IEC 60384-22:2019) EN IEC 60384-22:2019) (german version)
Edition 2023-05-01

Railway applications - Rolling stock - Electronic equipment (german version)
Edition 2022-07-01

Connectors for electronic equipment - Part 7: Detail specification for 8-way, unshielded, free and fixed connectors (( IEC 60603-7:2020) EN IEC 60603-7:2020) (german version)
Edition 2022-11-01

Environmental testing - Part 2-20: Tests - Test Ta and Tb: Test methods for solderability and resistance to soldering heat of devices with leads ((IEC 60068-2-20:2021) EN IEC 60068-2-20:2021) (german version)
Edition 2022-08-01