EMC IC modelling - Part 1: General modelling framework
Edition 2019-04

Railway applications - Rolling stock - Electronic equipment
Edition 2017-10

Plasma display panels - Part 2-5: Measuring methods - Acoustic noise
Edition 2012-08

Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-107: Dimensions of subracks and plug-in units, small form factor
Edition 2012-03

Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (P-PFBGA and P-PFLGA)
Edition 2011-04

Integrated circuits - Measurement of electromagnetic emissions - Part 8: Measurement of radiated emissions - IC stripline method
Edition 2011-10

Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA
Edition 2007-06

Mechanical structures for electronic equipment practices. Part 2-3: Sectional specification - Interface co-ordination dimensions for the 25 mm equipment practice - Extended detail specification - Dimensions for subracks, chassis, backplanes, front
Edition 2006-07

Materials for printed boards and other interconnecting structures. Part 2-21: Reinforced base materials, clad and unclad - Non-halogenated epoxide woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
Edition 2004-01

Materials for printed boards and other interconnecting structures. Part 2-6: Reinforced base materials, clad and unclad - Brominated epoxide non-woven/woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
Edition 2004-01