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Standards [CURRENT]

DIN EN 60068-2-81

Environmental testing - Part 2-81: Tests - Test Ei: Shock - Shock response spectrum synthesis (IEC 60068-2-81:2003); German version EN 60068-2-81:2003
Edition 2004-07

Standards [CURRENT]

DIN EN 62330-1

Helical-scan digital video cassette recording system using 12,65 mm (0,5 in) magnetic tape - Format HD-D5 - Part 1: VTR specifications (IEC 62330-1:2003); German version EN 62330-1:2004
Edition 2004-08

Standards [CURRENT]

DIN EN 61947-2

Electronic projection - Measurement and documentation of key performance criteria - Part 2: Variable resolution projectors (IEC 61947-2:2001); German version EN 61947-2:2002
Edition 2002-07

Standards [CURRENT]

DIN EN 60870-5-5

Telecontrol equipment and systems - Part 5: Transmission protocols; section 5: Basic application functions (IEC 60870-5-5:1995); German version EN 60870-5-5:1995
Edition 1996-07

Standards [CURRENT]

DIN EN IEC 62942

File format for professional transfer and exchange of digital audio data (IEC 62942:2019); German version EN IEC 62942:2020
Edition 2020-09

Standards [CURRENT]

DIN EN 60154-2

Flanges for waveguides - Part 2: Relevant specifications for flanges for ordinary rectangular waveguides (IEC 60154-2:2016); German version EN 60154-2:2016
Edition 2017-08

Standards [CURRENT]

DIN EN 60404-1

Magnetic materials - Part 1: Classification (IEC 60404-1:2016); German version EN 60404-1:2017
Edition 2017-08

Standards [CURRENT]

DIN EN 60118-0

Electroacoustics - Hearing aids - Part 0: Measurement of the performance characteristics of hearing aids (IEC 60118-0:2015); German version EN 60118-0:2015
Edition 2016-09

Standards [CURRENT]

DIN EN IEC 60384-17

Fixed capacitors for use in electronic equipment - Part 17: Sectional specification - Fixed metallized polypropylene film dielectric AC and pulse capacitors (IEC 60384-17:2019); German version EN IEC 60384-17:2019
Edition 2019-12

Standards [CURRENT]

DIN EN 60191-4

Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages (IEC 60191-4:2013 + A1:2018); German version EN 60191-4:2014 + A1:2018
Edition 2019-02

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