Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz. Part 2: Measurement of radiated emissions, TEM cell and wideband TEM cell method
Edition 2005-10

Connectors for electronic equipment - Printed board connectors. Part 4-113: Detail specification for two-part connectors having 5 rows with a grid of 2,54 mm for printed boards and backplanes in bus applications
Edition 2003-02

Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz. Part 5: Measurement of conducted emissions - Workbench Faraday Cage method
Edition 2003-04

Connectors for frequencies below 3 MHz for use with printed boards. Part 10: Two-part connectors for printed boards for basic grid of 2,54 mm (0,1 in), inverted type
Edition 1998-01

Solderless connections - Part 6: Solderless insulation piercing connections - General requirements, test methods and practical guidance
Edition 1997-10

Materials for interconnection structures. Part 5: Sectional specification set for conductive foils and films with or without coatings. Section 4: Conductive inks
Edition 1996-08

Connectors with assessed quality for use in d.c., low-frequency analogue and in digital high speed data applications. Part 4: Printed board connectors. Section 102: Detail specification for two-part single-pole connectors, for multiple uses on plug
Edition 1997-06

Environmental testing. Part 2: Tests - Test XA and guidance: Immersion in cleaning solvents
Edition 1992

Insulation coordination for equipment within low-voltage systems - Part 3: Use of coating, potting or moulding for protection against pollution
Edition 2017-06