Fixed resistors for use in electronic equipment. Sectional specification: Power resistors for through hole assembly on circuit boards (THT) or for assembly on chassis
Edition 2023-02-02

Fixed resistors for use in electronic equipment. Blank detail specification: Power resistors with axial leads for through-hole assembly on circuit boards (THT), for general electronic equipment, classification level G
Edition 2024-01-19

Materials for printed boards and other interconnecting structures. Reinforced base materials clad and unclad. High performance, non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
Edition 2013-04-30

Survey of Resolutions of the CENELEC General Assembly
Edition 2022-04-14

Survey of Resolutions of the CENELEC General Assembly
Edition 2014-05-31

Generic requirements for printed board assembly products manufacturing description data and transfer methodology
Edition 2014-10-31

Device embedding assembly technology. Guidelines. Accelerated stress testing of passive embedded circuit boards
Edition 2019-04-01

Device embedding assembly technology. Guidelines. Warpage control of active device embedded substrate
Edition 2021-07-29

Device embedding assembly technology. Guidelines. Concept of JISSO level in the electronic assembly technology industries
Edition 2022-08-23

Plugs, socket-outlets, vehicle connectors and vehicle inlets. Conductive charging of electric vehicles. Vehicle connector, vehicle inlet and cable assembly for DC charging intended to be used with a thermal management system
Edition 2020-03-31