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BS IEC 60115-4
Fixed resistors for use in electronic equipment. Sectional specification: Power resistors for through hole assembly on circuit boards (THT) or for assembly on chassis
Edition
2023-02-02
BS IEC 60115-4-10
Fixed resistors for use in electronic equipment. Blank detail specification: Power resistors with axial leads for through-hole assembly on circuit boards (THT), for general electronic equipment, classification level G
Edition
2024-01-19
BS EN 61249-2-40
Materials for printed boards and other interconnecting structures. Reinforced base materials clad and unclad. High performance, non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
Edition
2013-04-30
PD CLC Guide 1
Survey of Resolutions of the CENELEC General Assembly
Edition
2022-04-14
PD CLC Guide 1
Survey of Resolutions of the CENELEC General Assembly
Edition
2014-05-31
PD IEC/PAS 61182-12
Generic requirements for printed board assembly products manufacturing description data and transfer methodology
Edition
2014-10-31
PD IEC/TR 62878-2-7
Device embedding assembly technology. Guidelines. Accelerated stress testing of passive embedded circuit boards
Edition
2019-04-01
PD IEC/TR 62878-2-8
Device embedding assembly technology. Guidelines. Warpage control of active device embedded substrate
Edition
2021-07-29
PD IEC/TR 62878-2-9
Device embedding assembly technology. Guidelines. Concept of JISSO level in the electronic assembly technology industries
Edition
2022-08-23
PD IEC/TS 62196-3-1
Plugs, socket-outlets, vehicle connectors and vehicle inlets. Conductive charging of electric vehicles. Vehicle connector, vehicle inlet and cable assembly for DC charging intended to be used with a thermal management system
Edition
2020-03-31