Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-105: Dimensions and design aspects for 1U chassis
Edition 2009-01

Mechanical structures for electrical and electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-109: Dimensions of chassis for embedded computing devices
Edition 2016-02

Mechanical structures for electrical and electronic equipment - Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series - Part 5: Cooling performance evaluation for indoor cabinets
Edition 2016-06

Mechanical structures for electronic equipment - Tests for IEC 60917 and IEC 60297 - Part 4: Combination of performance levels for modular cabinets
Edition 2012-10

Mechanical structures for electronic equipment - Tests for IEC 60917 and IEC 60297 - Part 2: Seismic tests for cabinets and racks
Edition 2011-10

Printed boards and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA)
Edition 2008-03

Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) consideration - Components with J leads on two sides
Edition 2007-11

Printed boards and printed board assemblies - Design and use. Part 5-2: Attachment (land/joint) considerations - Discrete components
Edition 2003-09

Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series. Part 3-103: Keying and alignment pin
Edition 2004-09

Mechanical structures for electrical and electronic equipment - Tests for IEC 60917 and IEC 60297 series - Part 6: Security aspects for indoor cabinets
Edition 2021-05