Device embedding assembly technology - Part 1: Generic specification for device embedded substrates (( IEC 62878-1:2019) EN IEC 62878-1:2019) (german version)
Edition 2021-11-01

Solderless connections - Part 5: Press-in connections - General requirements, test methods and practical guidance
Edition 2020-09

Mechanical structures for electrical and electronic equipment - Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series - Part 5: Cooling performance evaluation for indoor cabinets ( IEC 62610-5:2016) (german version)
Edition 2017-03-01

Insulation coordination for equipment within low-voltage systems - Part 3: Use of coating, potting or moulding for protection against pollution ( IEC 60664-3:2016) (german version)
Edition 2017-12-01

Mechanical structures for electrical and electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-109: Dimensions of chassis for embedded computing devices (IEC 60297-3-109:2015) (german version)
Edition 2016-10-01

Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-101: Subracks and associated plug-in units (IEC 60297-3-101:2004)
Edition 2005-07-01

Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-102: Injector/extractor handle (IEC 60297-3-102:2004)
Edition 2005-07-01

Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-103: Keying and alignment pin (IEC 60297-3-103:2004)
Edition 2005-07-01

Connectors with assessed quality, for use in d.c., low frequency analogue and in digital high-speed data applications - Part 4: Printed board connectors - Section ....(abbreviated)
Edition 1997-09-24

Connectors for frequencies below 3 MHz for use with printed boards - Part 10: Two-part connectors for printed boards for basic grid of 2,54 mm (0,1 in), inverted type
Edition 1998-05-19