Connectors for electronic equipment - Part 7-4: Detail specification for 8-way, unshielded, free and fixed connectors, for data transmissions with frequencies up to 250 MHz
Edition 2010-07

Connectors for electronic equipment - Part 7-7: Detail specification for 8-way, shielded, free and fixed connectors for data transmission with frequencies up to 600 MHz
Edition 2010-09

Connectors for electronic equipment - Part 7-71: Detail specification for 8-way, shielded, free and fixed connectors, for data transmission with frequencies up to 1000 MHz
Edition 2010-10

Connectors for electronic equipment - Tests and measurements. Part 10-4: Impact tests (free components), static load tests (fixed components), endurance tests and overload tests - Test 10d: Electrical overload (connectors)
Edition 2003-10

Materials for printed boards and other interconnecting structures - Part 2-45 : reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity (1.0W/m.K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
Edition 2018-03-23

Materials for printed boards and other interconnecting structures - Part 2-46 : reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity (1.5W/m K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
Edition 2018-03-23

Materials for printed boards and other interconnecting structures - Part 2-42 : reinforced base materials clad and unclad - Brominated epoxide non-woven / woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
Edition 2010-07-01

Materials for printed boards and other interconnecting structures - Part 4-16 : sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
Edition 2014-02-01

Materials for printed boards and other interconnecting structures - Part 4-19 : sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance, non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
Edition 2014-03-19

Materials for printed boards and other interconnecting structures - Part 2-44 : reinforced base materials clad and unclad - Non halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
Edition 2016-09-10