Modular order for the development of mechanical structures for electronic equipment practices - Part 2-5: Sectional specification - Interface coordination dimensions for the 25 mm equipment practice - Cabinet interface dimensions for miscellaneous equipment
Edition 2012-10

Modular order for the development of mechanical structures for electronic equipment practices - Part 2-4: Sectional specification - Interface co-ordination dimensions for the 25 mm equipment practice - Adaptation dimensions for subracks or chassis applicable in cabinets or racks in accordance with IEC 60297-3-100 (19 in)
Edition 2010-04

Connectors for frequencies below 3 MHz for use with printed boards. Part 2: Detail specification for two-part connectors of assessed quality, for printed boards, for basic grid of 2,54 mm (0,1 in), with common mounting features
Edition 1998-08

Materials for interconnection structures. Part 8: Sectional specification set for non-conductive films and coatings. Section 7: Marking legend inks
Edition 1996-08

Connectors for frequencies below 3 MHz for use with printed boards. Part 2: Detail specification for two-part connectors with assessed quality, for printed boards, for basic grid of 2,54 mm (0,1 in) with common mounting features
Edition 2005-05

Information Technology Equipment - Safety - Part 1: General Requirements (Bi-National standard, with UL 60950-1)
Edition 2014-10-01

Information Technology Equipment - Safety - Part 1: General Requirements
Edition 2007-03-01

Information Technology Equipment - Safety - Part 1: General Requirements (Bi-National standard, with UL 60950-1); Amendment 1
Edition 2011-12-01

Device embedding assembly technology - Part 2-5: Guidelines - Implementation of a 3D data format for device embedded substrate ((IEC 62878-2-5:2019) EN IEC 62878-2-5:2019) (german version)
Edition 2021-05-01