Electronic components - Long-term storage of electronic semiconductor devices - Part 3: Data ((IEC 62435-3:2020) EN IEC 62435-3:2020) (german version)
Edition 2022-06-01

Electronic components - Long-term storage of electronic semiconductor devices - Part 3: Data
Edition 2020-04

EMC IC modelling - Part 2: Models of integrated circuits for EMI behavioural simulation - Conducted emissions modelling (ICEM-CE) (IEC 62433-2:2017) (german version)
Edition 2017-11-01

Connectors for frequencies below 3 MHz for use with printed boards. Part 2: Detail specification for two-part connectors with assessed quality, for printed boards, for basic grid of 2,54 mm (0,1 in) with common mounting features
Edition 2005-05

Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA (IEC 60191-6-16:2007)
Edition 2007-12-01

Plasma display panels - Part 3-2: Interface - Electrical interface (IEC 61988-3-2:2009) (german version)
Edition 2010-06-01

Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz. Part 6: Measurement of conducted emissions, magnetic probe method
Edition 2002-10

Connectors for electronic equipment - Printed board connectors - Part 4-113: Detail specification for two-part connectors having 5 rows with a grid of 2,54 mm for printed boards and backplanes in bus applications (IEC 61076-4-113:2002)
Edition 2003-09-01

Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 7: Marking legend inks
Edition 1996-10-10

Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 2: Measurement of radiated emissions, TEM cell and wideband TEM cell method (IEC 61967-2:2005)
Edition 2006-04-01