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DIN EN IEC 60749-5 ; VDE 0884-749-5:2024-09
Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test (IEC 60749-5:2023); German version EN IEC 60749-5:2024
Edition
2024-09
DIN EN IEC 60749-5
Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test (IEC 47/2770/CDV:2022); German and English version prEN IEC 60749-5:2022
Edition
2024-04
DIN EN 60749-5
Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test (IEC 60749-5:2017); German version EN 60749-5:2017
Edition
2018-01
DIN EN IEC 60749-20
Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat (IEC 60749-20:2020); German version EN IEC 60749-20:2020
Edition
2023-07
DIN EN 60749-24
Semiconductor devices - Mechanical and climatic test methods - Part 24: Accelerated moisture resistance - Unbiased HAST (IEC 60749-24:2004); German version EN 60749-24:2004
Edition
2004-09
DIN EN 60749-33
Semiconductor devices - Mechanical and climatic test methods - Part 33: Accelerated moisture resistance - Unbiased autoclave (IEC 60749-33:2004); German version EN 60749-33:2004
Edition
2004-09
DIN EN 61163-1
Reliability stress screening - Part 1: Repairable assemblies manufactured in lots (IEC 61163-1:2006); German version EN 61163-1:2006
Edition
2007-06
DIN EN 61163-2
Reliability stress screening - Part 2: Components (IEC 56/1623/CD:2015)
Edition
2015-12
DIN EN IEC 61189-2-630
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-630: Test methods for materials for interconnection structures - Moisture absorption after pressure vessel conditioning (IEC 61189-2-630:2018); German version EN IEC 61189-2-630:2018
Edition
2019-03
DIN EN 61189-3-719
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling (IEC 61189-3-719:2016); German version EN 61189-3-719:2016
Edition
2016-12