Semiconductor devices - Part 16-4: Microwave integrated circuits - Switches (IEC 60747-16-4:2004 + A1:2009 + A2:2017); German version EN 60747-16-4:2004 + A1:2011 + A2:2017
Edition 2018-04

Fibre optic sensors - Part 2-2: Temperature measurement - Distributed sensing (IEC 61757-2-2:2016); German version EN 61757-2-2:2017
Edition 2018-06

Electroacoustics - Audio-frequency induction loop systems for assisted hearing - Part 1: Methods of measuring and specifying the performance of system components (IEC 62489-1:2010 + A1:2014 + A2:2017); German version EN 62489-1:2010 + A1:2015 + A2:2018
Edition 2018-09

Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices (IEC 61760-4:2015 + A1:2018); German version EN 61760-4:2015 + A1:2018
Edition 2018-09

Industrial-process control valves - Part 8-4: Noise considerations - Prediction of noise generated by hydrodynamic flow (IEC 60534-8-4:2015); German version EN 60534-8-4:2015
Edition 2017-01

Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 3: Selection guidance of erosion test methods (IEC 62739-3:2017); German version EN 62739-3:2017
Edition 2017-10

Dynamic modules - Part 4-1: Software and hardware interface - 1 x 9 wavelength selective switch (IEC 62343-4-1:2016); German version EN 62343-4-1:2016
Edition 2017-02

Fixed capacitors for use in electronic equipment - Part 18: Sectional specification - Fixed aluminium electrolytic surface mount capacitors with solid (MnO₂) and non-solid electrolyte (IEC 60384-18:2016); German version EN 60384-18:2016
Edition 2017-03

Industrial-process measurement, control and automation - Evaluation of system properties for the purpose of system assessment - Part 8: Assessment of other system properties (IEC 61069-8:2016); German version EN 61069-8:2016
Edition 2017-04

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies (IEC 61189-5-1:2016); German version EN 61189-5-1:2016
Edition 2017-04