Specification for Embedded Passive Device Resistor Materials for Rigid and Multilayer Printed Boards
Edition 2008-05-30

Specification for Embedded Passive Device Capacitor Materials for Rigid and Multilayer Printed Boards
Edition 2006-06-12

1710A - OEM Standard for Printed Board Manufacturer's Qualification Profile (MQP)
Edition 2004-08-02

Design Guide for the Packaging of High Speed Electronic Circuits
Edition 2003-12-08

Design Guide for High Density Interconnects & Microvias
Edition 2000-11-01

Report on Round Robin Study to Correlate Interconnect Stress Test (IST) with Thermal Stress/Microsectioning Evaluations for Detecting the Presence of Inner-layer Separations
Edition 2001-07-17

Circuit Board Ionic Cleanliness Measurement: What Does it Tell Us?
Edition 1994-12-31

Test Methods for Characterization of Printed Board Assembly Pad Cratering
Edition 2010-12-14

Guidelines for Chip-on-Board Technology Implementation
Edition 1990-11-01

Specification for Embedded Passive Device Capacitor Materials for Rigid and Multilayer Printed Boards; Amendment 1
Edition 2010-04