Resin Coated Copper Foil for Printed Boards Guideline
Edition 2008-02-11

Design Guide for Protection of Printed Board Via Structures
Edition 2006-07-20

Time, Temperature and Humidity Stress of Final Board Finish Solderability; no Hard Copy
Edition 2006-06-22

End-Item DPMO for Printed Circuit Board Assemblies
Edition 2004-01-29

Specification and Characterization Methods for Nonwoven Para-Aramid Reinforcement
Edition 2003-11-12

Users Guide for Cleanliness of Unpopulated Printed Boards
Edition 2003-07-22

Specification for High Density Interconnect (HDI) and Microvia Materials
Edition 1999-05-09

Design Standard for Thick Film Multilayer Hybrid Circuits
Edition 1989-12-01

Specification for Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Plating for Printed Circuit Boards
Edition 2013-02-04

Cleanliness Guidelines for Printed Board Fabricators
Edition 2013-05-17