Materials for printed boards and other interconnecting structures - Part 2-39: Reinforced base materials clad and unclad - High performance epoxide and non-epoxide, woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (IEC 61249-2-39:2012); German version EN 61249-2-39:2013
Edition 2013-09

Radio-frequency connectors - Part 41: Sectional specification for CQA series quick lock R.F. coaxial connectors (IEC 61169-41:2011); German version EN 61169-41:2011
Edition 2011-12

Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS (IEC 62047-9:2011); German version EN 62047-9:2011
Edition 2012-03

Optical circuit boards - Part 2-1: Measurements - Optical attenuation and isolation (IEC 62496-2-1:2011); German version EN 62496-2-1:2011
Edition 2012-06

Digital audio - Interface for non-linear PCM encoded audio bitstreams applying IEC 60958 - Part 1: General (IEC 61937-1:2007 + A1:2011); German version EN 61937-1:2007 + A1:2011
Edition 2012-08

Organic light emitting diode displays - Part 1-2: Terminology and letter symbols (IEC 62341-1-2:2007); German version EN 62341-1-2:2009
Edition 2010-09

Connectors for electronic equipment - Product requirements - Part 3-116: Rectangular connectors - Detail specification for protective housings for use with 8-way shielded and unshielded connectors for frequencies up to 600 MHz for industrial environments incorporating the IEC 60603-7 series interface - Variant 13 related to IEC 61076-3-106 - Locking lever (IEC 61076-3-116:2008); German version EN 61076-3-116:2008
Edition 2009-07

Materials for printed boards and other interconnecting structures - Part 2-36: Reinforced base materials, clad and unclad - Epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (IEC 61249-2-36:2008); German version EN 61249-2-36:2009
Edition 2009-07

Materials for printed boards and other interconnecting structures - Part 2-37: Reinforced base materials, clad and unclad - Modified non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (IEC 61249-2-37:2008); German version EN 61249-2-37:2009
Edition 2009-07

Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages (IEC 60191-6:2009); German version EN 60191-6:2009
Edition 2010-06