Electromagnetic compatibility and Radio spectrum Matters (ERM) - Road Transport and Traffic Telematics (RTTT) - Dedicated Short Range Communication (DSRC) transmission equipment (500 kbit/s / 250 kbit/s) operating in the 5,8 GHz Industrial, Scientific and Medical (ISM) band - Part 2: Harmonized EN under article 3.2 of the R&TTE Directive - Sub-part 2: Requirements for the On-Board Units (OBU)
Edition 2004-10-01

Connectors for electronic equipment - Product requirements - Part 4-116: Printed board connectors - Detail specification for a high-speed two-part connector with integrated shielding function (IEC 48B/2357/CDV) (Amendment)
Edition 2013-10-15

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-913: Test method for thermal conductivity of printed circuit board for high-brightness LEDs (IEC 91/1214/CDV)
Edition 2015-01-15

Soft soldering - Part 5: Registration and analysis of defects on printed board assemblies (IEC 91/182/CDV)
Edition 2000-03-01

Materials for printed boards and other interconnecting structures - Part 2-31: Reinforced base materials clad and unclad for high frequency application - Halogenated modified or unmodified resin system, woven E-glass laminated sheets of defined relative permittivity (equal or less than 4,1 at 1 GHz) and flammability (vertical burning test), copper-clad (IEC 91/671/CDV)
Edition 2007-07-01

Materials for printed boards and other interconnecting structures - Part 2-32: Reinforced base materials clad and unclad for high frequency application - Halogenated modified or unmodified resin system, woven E-glass laminated sheets of defined relative permittivity (equal or less than 3,7 at 1 GHz) and flammability (vertical burning test), copper-clad (IEC 91/673/CDV)
Edition 2007-07-01

Materials for printed boards and other interconnecting structures - Part 2-33: Reinforced base materials clad and unclad for high frequency application - Non-halogenated modified or unmodified resin system, woven E-glass laminated sheets of defined relative permittivity (equal or less than 4,1 at 1 GHz) and flammability (vertical burning test), copper-clad (IEC 91/675/CDV)
Edition 2007-07-01

Materials for printed boards and other interconnecting structures - Part 2-34: Reinforced base materials clad and unclad for high frequency application - Non-halogenated modified or unmodified resin system, woven E-glass laminated sheets of defined relative permittivity (equal or less than 3,7 at 1 GHz) and flammability (vertical burning test), copper-clad (IEC 91/677/CDV)
Edition 2007-07-01

Printed boards - Part 3: Safety certification of rigid printed circuit boards for use in electronic assemblies (performance for capability approval) (IEC 91/445/CDV)
Edition 2004-05-01

The marking for the presence and absence of the specified chemical substances in materials, components and mounted boards used in electrical and electronic equipment (IEC 91/642/CDV)
Edition 2007-03-01