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Standards [CURRENT]

DIN EN 140401-803

Detail specification: Fixed low power film SMD resistors - Cylindrical - Stability classes 0,05; 0,1; 0,25; 0,5; 1; 2; German version EN 140401-803:2007 + A1:2010 + A2:2013 + A3:2017
Edition 2017-09

Standards [CURRENT]

DIN EN IEC 61757-4-3

Fibre optic sensors - Part 4-3: Electric current measurement - Polarimetric method (IEC 61757-4-3:2020); German version EN IEC 61757-4-3:2020
Edition 2022-07

Standards [CURRENT]

DIN EN IEC 61189-5-601

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-601: General test methods for materials and assemblies - Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards (IEC 61189-5-601:2021); German version EN IEC 61189-5-601:2021
Edition 2022-12

Standards [CURRENT]

DIN EN IEC 60352-4

Solderless connections - Part 4: Non-accessible insulation displacement (ID) connections - General requirements, test methods and practical guidance (IEC 60352-4:2020); German version EN IEC 60352-4:2020
Edition 2021-09

Standards [CURRENT]

DIN EN 60115-8-1

Fixed resistors for use in electronic equipment - Part 8-1: Blank detail specification: Fixed surface mount (SMD) low power film resistors for general electronic equipment, classification level G (IEC 60115-8-1:2014, modified); German version EN 60115-8-1:2015
Edition 2016-03

Standards [CURRENT]

DIN EN 61514-2

Industrial process control systems - Part 2: Methods of evaluating the performance of intelligent valve positioners with pneumatic outputs mounted on an actuator valve assembly (IEC 61514-2:2013); German version EN 61514-2:2013
Edition 2014-06

Standards [CURRENT]

DIN EN 61300-3-38

Fibre optic interconnecting devices and passive components - Basic test and measurement procedures - Part 3-38: Examinations and measurements - Group delay, chromatic dispersion and phase ripple (IEC 61300-3-38:2012); German version EN 61300-3-38:2012
Edition 2013-04

Standards [CURRENT]

DIN EN 60749-20-1

Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat (IEC 60749-20-1:2009); German version EN 60749-20-1:2009
Edition 2009-10

Standards [CURRENT]

DIN EN 62261-2

Television METADATA - Part 2: Data encoding protocol using key-length-value (IEC 62261-2:2005); German version EN 62261-2:2006
Edition 2007-04

Standards [CURRENT]

DIN EN 62326-1

Printed boards - Part 1: Generic specification (IEC 62326-1:2002); German version EN 62326-1:2002
Edition 2002-12

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