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Standards [CURRENT]

DIN EN 61290-4-2

Optical amplifiers - Test methods - Part 4-2: Gain transient parameters - Broadband source method (IEC 61290-4-2:2011); German version EN 61290-4-2:2011
Edition 2012-04

Standards [CURRENT]

DIN EN 60749-27

Semiconductor devices - Mechanical and climatic test methods - Part 27: Electrostatic discharge (ESD) sensitivity testing - Machine model (MM) (IEC 60749-27:2006 + A1:2012); German version EN 60749-27:2006 + A1:2012
Edition 2013-04

Standards [CURRENT]

DIN EN 61937-12

Digital audio - Interface for non-linear PCM encoded audio bitstreams applying IEC 60958 - Part 12: Non-linear PCM bitstreams according to the DRA formats (IEC 61937-12:2010); German version EN 61937-12:2010
Edition 2011-01

Standards [CURRENT]

DIN EN 62047-4

Semiconductor devices - Micro-electromechanical devices - Part 4: Generic specification for MEMS (IEC 62047-4:2008); German version EN 62047-4:2010
Edition 2011-03

Standards [CURRENT]

DIN EN 60384-26-1

Fixed capacitors for use in electronic equipment - Part 26-1: Blank detail specification - Fixed aluminum electrolytic capacitors with conductive polymer solid electrolyte - Assessment level EZ (IEC 60384-26-1:2010); German version EN 60384-26-1:2010
Edition 2011-07

Standards [CURRENT]

DIN EN 61300-3-3

Fibre optic interconnecting devices and passive components - Basic test and measurement procedures - Part 3-3: Examinations and measurements - Active monitoring of changes in attenuation and return loss (IEC 61300-3-3:2009); German version EN 61300-3-3:2009
Edition 2009-12

Standards [CURRENT]

DIN EN 61249-4-16

Materials for printed boards and other interconnecting structures - Part 4-16: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly (IEC 61249-4-16:2009); German version EN 61249-4-16:2009
Edition 2009-12

Standards [CURRENT]

DIN EN 61249-4-17

Materials for printed boards and other interconnecting structures - Part 4-17: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly (IEC 61249-4-17:2009); German version EN 61249-4-17:2009
Edition 2009-12

Standards [CURRENT]

DIN EN 61076-3-117

Connectors for electronic equipment - Product requirements - Part 3-117: Rectangular connectors - Detail specification for protective housings for use with 8-way shielded and unshielded connectors for industrial environments incorporating the IEC 60603-7 series interface - Variant 14 related to IEC 61076-3-106 - Push pull coupling (IEC 61076-3-117:2009); German version EN 61076-3-117:2009
Edition 2010-01

Standards [CURRENT]

DIN EN 61249-2-42

Materials for printed boards and other interconnecting structures - Part 2-42: Reinforced base materials clad and unclad - Brominated epoxide non-woven / woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (IEC 61249-2-42:2010); German version EN 61249-2-42:2010
Edition 2010-12

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