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Standards [CURRENT]

DIN EN IEC 60749-12

Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency (IEC 60749-12:2017); German version EN IEC 60749-12:2018
Edition 2018-07

Standards [CURRENT]

DIN EN 61290-5-1

Optical amplifiers - Test methods - Part 5-1: Reflectance parameters - Optical spectrum analyzer method (IEC 61290-5-1:2006); German version EN 61290-5-1:2006
Edition 2007-03

Standards [CURRENT]

DIN 6625-1

Angular steel tanks for above ground storage of liquids with a flashpoint of more than 55 °C - Part 1: Principles for installation and test
Edition 2013-06

Standards [CURRENT]

DIN EN 62047-2

Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials (IEC 62047-2:2006); German version EN 62047-2:2006
Edition 2007-02

Standards [CURRENT]

DIN EN 62047-8

Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films (IEC 62047-8:2011); German version EN 62047-8:2011
Edition 2011-12

Standards [CURRENT]

DIN EN 3665

Aerospace series - Test methods for paints and varnishes - Filiform corrosion resistance test on aluminium alloys; German version EN 3665:1997
Edition 1997-08

Standards [CURRENT]

DIN EN ISO 7278-1

Liquid hydrocarbons - Dynamic measurement - Proving systems for volumetric meters - Part 1: General principles (ISO 7278-1:1987); German version EN ISO 7278-1:1995
Edition 1996-12

Standards [CURRENT]

DIN EN 62047-22

Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates (IEC 62047-22:2014); German version EN 62047-22:2014
Edition 2015-04

Standards [CURRENT]

DIN EN 62047-21

Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for Poisson's ratio of thin film MEMS materials (IEC 62047-21:2014); German version EN 62047-21:2014
Edition 2015-04

Standards [CURRENT]

DIN EN 60749-20-1

Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat (IEC 60749-20-1:2009); German version EN 60749-20-1:2009
Edition 2009-10

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