Endurance test methods for die attach materials applied to power electronics devices - Part 2: Temperature cycling test method and reliability performance index for Die attach materials applied to discrete type power electronic devices (IEC 91/1660/CD:2020); Text in German and English
Edition 2021-01

Luminaire performance - Part 1: General requirements (IEC 34D/1593/CD:2020); Text in German and English
Edition 2021-07

Semiconductor devices - Guidelines for reliability qualification plans - Part 2: Concept of mission profile (IEC 47/2718/CDV:2021); German and English version prEN IEC 63287-2:2021
Edition 2022-06

Wearable electronic devices and technologies - Part 402-3: Performance measurement method of wearables - Series 2: Accuracy of Heart Rate Determination (IEC 124/167/CD:2021); Text in German and English
Edition 2023-02

OPC Unified Architecture - Part 1: Overview and Concepts (IEC 65E/1039/CDV:2024); German and English version prEN IEC 62541-1:2024
Edition 2024-08

Semiconductor devices - Semiconductor devices for IOT system - Part 1: Test method of sound variation detection (IEC 47/2742/CDV:2021); German and English version prEN IEC 63364-1:2021
Edition 2023-10

Representation of electrical & instrument objects in digital 3D plant models during engineering - Engineering of process plant instrumentation - 3D model requirements (IEC 65E/1021/CDV:2023); German and English version prEN IEC 63261:2023
Edition 2024-04

Fibre optic interconnecting devices and passive components - Fibre optic connector optical interfaces - Part 3-7: Optical interface connectors with 2,5 mm and 1,25 mm diameter cylindrical composite ferrule using titanium as fibre surrounding material, non-angled polished single mode fibre (IEC 86B/3739/CD:2014)
Edition 2014-06

Fibre optic interconnecting devices and passive components - Fibre optic connector optical interfaces - Part 3-8: Optical interface, connectors with 2,5 mm and 1,25 mm diameter cylindrical for 8 degrees angled polished composite ferrule using titanium as fibre surrounding material, non-angled polished single mode fibre (IEC 86B/3741/CD:2014)
Edition 2014-06

Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test (IEC 47/2770/CDV:2022); German and English version prEN IEC 60749-5:2022
Edition 2024-04