Materials for printed boards and other interconnecting structures - Part 2-39: Reinforced base materials clad and unclad - High performance epoxide and non-epoxide, woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (IEC 61249-2-39:2012); German version EN 61249-2-39:2013
Edition 2013-09

Materials for printed boards and other interconnecting structures - Part 2-40: Reinforced base materials clad and unclad - High performance, non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (IEC 61249-2-40:2012); German version EN 61249-2-40:2013
Edition 2013-09

Fibre optic interconnecting devices and passive components - Fibre optic connector product specifications - Part 1-1: LC-PC duplex multimode connectors terminated on IEC 60793-2-10 category A1a fibre (IEC 62664-1-1:2013); German version EN 62664-1-1:2013
Edition 2013-12

Fibre optic interconnecting devices and passive components - Performance standard - Part 059-2: Single-mode fibre plug-receptacle style optical limiter for category C - Controlled environment (IEC 61753-059-2:2013); German version EN 61753-059-2:2013
Edition 2013-12

Fibre optic interconnecting devices and passive components - Performance standard - Part 088-2: Non-connectorized single-mode fibre optic LAN WDM devices with channel spacing of 800 GHz for category C - Controlled environments (IEC 61753-088-2:2013); German version EN 61753-088-2:2013
Edition 2013-12

Radio-frequency connectors - Part 41: Sectional specification for CQA series quick lock R.F. coaxial connectors (IEC 61169-41:2011); German version EN 61169-41:2011
Edition 2011-12

Radio-frequency connectors - Part 14: R.F. coaxial connectors with inner diameter of outer conductor 12 mm with screw coupling - Characteristic impedance 75 ohms (Type 3,5/12) (IEC 61169-14:2010); German version EN 61169-14:2010
Edition 2011-10

Optical circuit boards - Part 2-2: Measurements - Dimensions of optical circuit boards (IEC 62496-2-2:2011); German version EN 62496-2-2:2011
Edition 2011-09

Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability (IEC 60749-21:2011); German version EN 60749-21:2011
Edition 2012-01

Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS (IEC 62047-9:2011); German version EN 62047-9:2011
Edition 2012-03