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EIA TSB 130
Generic Guidelines for Connectorized Polarization Maintaining Fiber and Polarizing Fiber Cable Assemblies for Use in Telecommunications Applications
Edition
2003-01
SN EN 1811
Reference test method for release of nickel from all post assemblies which are inserted into pierced parts of the human body and articles intended to come into direct and prolonged contact with the skin
Edition
2023-02
SN EN 17415-2
District cooling pipes - Bonded single pipe systems for directly buried cold water networks - Part 2: Factory made fitting assemblies of steel or plastic service pipe, polyurethane thermal insulation and a casing of polyethylene
Edition
2021-09
SN EN IEC 61189-2-807
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition temperature (Td) using TGA
Edition
2021-10
SN EN IEC 61188-6-2
Circuit boards and circuit board assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD)
Edition
2021-03
SN EN 15698-2
District heating pipes - Bonded twin pipe systems for directly buried hot water networks - Part 2: Factory made fitting and valve assemblies of steel service pipes, polyurethane thermal insulation and one casing of polyethylene
Edition
2020-06
SN EN 448
District heating pipes - Bonded single pipe systems for directly buried hot water networks - Factory made fitting assemblies of steel service pipes, polyurethane thermal insulation and a casing of polyethylene
Edition
2020-06
SN EN 489-1
District heating pipes - Bonded single and twin pipe systems for buried hot water networks - Part 1: Joint casing assemblies and thermal insulation for hot water networks in accordance with EN 13941-1
Edition
2020-06
SN EN IEC 61188-6-4
Printed boards and printed board assemblies - Design and use - Part 6-4: Land pattern design - Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design
Edition
2019-07
SN EN IEC 61189-2-630
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-630: Test methods for materials for interconnection structures - Moisture absorption after pressure vessel conditioning
Edition
2018-10
