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DIN EN 62047-20
Semiconductor devices - Micro-electromechanical devices - Part 20: Gyroscopes (IEC 62047-20:2014); German version EN 62047-20:2014
Edition
2015-04
DIN EN IEC 61189-5-502
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-502: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of assemblies (IEC 61189-5-502:2021); German version EN IEC 61189-5-502:2021
Edition
2022-05
DIN EN 50377-8-12
Connector sets and interconnect components to be used in optical fibre communication systems - Product specifications - Part 8-12: Type LSH-APC simplex terminated on IEC 60793-2-50 category B1.1 and B1.3 singlemode fibre with titanium composite ferrule for category U; German version EN 50377-8-12:2010
Edition
2010-12
DIN EN 50377-2-2
Connector sets and interconnect components to be used in optical fibre communication systems - Products specifications - Part 2-2: FC/APC 8 terminated on IEC 60793-2-50 Category B1.1 and B1.3 singlemode fibre, with full zirconia ferrule, category C; German version EN 50377-2-2:2009
Edition
2009-11
DIN EN 61188-5-4
Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides (IEC 61188-5-4:2007); German version EN 61188-5-4:2007
Edition
2008-07
DIN EN 62345
ID format for 50 mm magneto-optical disc system (IEC 62345:2005); German version EN 62345:2005, text in English
Edition
2005-09
DIN EN IEC 60384-17
Fixed capacitors for use in electronic equipment - Part 17: Sectional specification - Fixed metallized polypropylene film dielectric AC and pulse capacitors (IEC 60384-17:2019); German version EN IEC 60384-17:2019
Edition
2019-12
DIN EN 62047-9
Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS (IEC 62047-9:2011); German version EN 62047-9:2011
Edition
2012-03
DIN EN 61188-5-6
Printed boards and printed board assemblies - Design and use - Part 5-6: Attachment (land/joint) considerations; Chip carriers with J-leads on four sides (IEC 61188-5-6:2003); German version EN 61188-5-6:2003
Edition
2003-10
DIN EN 61188-5-3
Printed boards and printed board assemblies - Design and use - Part 5-3: Attachment (land/joint) considerations - Components with gull-wing leads on two sides (IEC 61188-5-3:2007); German version EN 61188-5-3:2007
Edition
2008-07