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Standards [CURRENT]

DIN EN 62047-20

Semiconductor devices - Micro-electromechanical devices - Part 20: Gyroscopes (IEC 62047-20:2014); German version EN 62047-20:2014
Edition 2015-04

Standards [CURRENT]

DIN EN IEC 61189-5-502

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-502: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of assemblies (IEC 61189-5-502:2021); German version EN IEC 61189-5-502:2021
Edition 2022-05

Standards [CURRENT]

DIN EN 50377-8-12

Connector sets and interconnect components to be used in optical fibre communication systems - Product specifications - Part 8-12: Type LSH-APC simplex terminated on IEC 60793-2-50 category B1.1 and B1.3 singlemode fibre with titanium composite ferrule for category U; German version EN 50377-8-12:2010
Edition 2010-12

Standards [CURRENT]

DIN EN 50377-2-2

Connector sets and interconnect components to be used in optical fibre communication systems - Products specifications - Part 2-2: FC/APC 8 terminated on IEC 60793-2-50 Category B1.1 and B1.3 singlemode fibre, with full zirconia ferrule, category C; German version EN 50377-2-2:2009
Edition 2009-11

Standards [CURRENT]

DIN EN 61188-5-4

Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides (IEC 61188-5-4:2007); German version EN 61188-5-4:2007
Edition 2008-07

Standards [CURRENT]

DIN EN 62345

ID format for 50 mm magneto-optical disc system (IEC 62345:2005); German version EN 62345:2005, text in English
Edition 2005-09

Standards [CURRENT]

DIN EN IEC 60384-17

Fixed capacitors for use in electronic equipment - Part 17: Sectional specification - Fixed metallized polypropylene film dielectric AC and pulse capacitors (IEC 60384-17:2019); German version EN IEC 60384-17:2019
Edition 2019-12

Standards [CURRENT]

DIN EN 62047-9

Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS (IEC 62047-9:2011); German version EN 62047-9:2011
Edition 2012-03

Standards [CURRENT]

DIN EN 61188-5-6

Printed boards and printed board assemblies - Design and use - Part 5-6: Attachment (land/joint) considerations; Chip carriers with J-leads on four sides (IEC 61188-5-6:2003); German version EN 61188-5-6:2003
Edition 2003-10

Standards [CURRENT]

DIN EN 61188-5-3

Printed boards and printed board assemblies - Design and use - Part 5-3: Attachment (land/joint) considerations - Components with gull-wing leads on two sides (IEC 61188-5-3:2007); German version EN 61188-5-3:2007
Edition 2008-07

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