Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-4: Cyclic bending test (IEC 62137-1-4:2009); German version EN 62137-1-4:2009
Edition 2009-08

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-5: Mechanical shear fatigue test (IEC 62137-1-5:2009); German version EN 62137-1-5:2009
Edition 2010-01

Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints (IEC 62137-3:2011); German version EN 62137-3:2012
Edition 2012-08

Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices (IEC 62137-4:2014); German version EN 62137-4:2014 + AC:2015
Edition 2015-07

Electronics assembly technology - Electronic modules (IEC 62421:2007); German version EN 62421:2007
Edition 2008-06

Device embedding assembly technology - Part 1: Generic specification for device embedded substrates (IEC 62878-1:2019); German version EN IEC 62878-1:2019
Edition 2021-10

Device embedding assembly technology - Part 2-5: Guidelines - Implementation of a 3D data format for device embedded substrate (IEC 62878-2-5:2019); German version EN IEC 62878-2-5:2019
Edition 2021-04

Device embedding assembly technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity (IEC 62878-2-602:2021); German version EN IEC 62878-2-602:2021
Edition 2022-08

End-suction centrifugal pumps - Baseplate and installation dimensions (ISO 3661:1977); German version EN ISO 3661:2010
Edition 2011-12

Industrial valves - Mounting kits for part-turn valve actuator attachment (ISO 5640:2024); German and English version prEN ISO 5640:2024
Edition 2024-08