Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures (IEC 62047-12:2011); German version EN 62047-12:2011
Edition 2012-06

Bias-temperature stability test for metal-oxide, semiconductor, field-effect transistors (MOSFET) (IEC 62373:2006); German version EN 62373:2006
Edition 2007-01

Aerospace series - Electrical contacts used in elements of connection - Part 053: Contacts, electrical, female 053, type A, crimp, class S - Product standard; German and English version EN 3155-053:2007
Edition 2008-05

Wood flooring and wood panelling and cladding - Determination of dimensional stability; German version EN 1910:2016
Edition 2016-08

Fibre optic interconnecting devices and passive components - Basic test and measurement procedures - Part 2-55: Tests - Strength of mounted adaptor (IEC 61300-2-55:2017); German version EN 61300-2-55:2017
Edition 2018-01

Blank detail specification - Fixed capacitors for direct current with electrodes of thin metal foils and a polycarbonate film dielectric - Assessment level EZ; German version EN 131702:1997
Edition 1998-11

Fixed capacitors for use in electronic equipment - Part 17-1: Blank detail specification - Fixed metallized polypropylene film dielectric a.c. and pulse capacitors - Assessment levels E and EZ (IEC 60384-17-1:2005); German version EN 60384-17-1:2005
Edition 2006-07

Fibre optic interconnecting devices and passive components - Basic test and measurement procedures - Part 2-9: Tests - Shock (IEC 61300-2-9:2017); German version EN 61300-2-9:2017
Edition 2017-10

Fibre optic interconnecting devices and passive components - Basic test and measurement procedures - Part 2-48: Tests - Temperature-humidity cycling (IEC 61300-2-48:2009); German version EN 61300-2-48:2009
Edition 2009-12

Aerospace series; elements of electrical and optical connection; test methods; general; german version EN 2591:1992
Edition 1992-12