Search results
Search list
Results in:
BS ISO 17109
Surface chemical analysis. Depth profiling. Method for sputter rate determination in X-ray photoelectron spectroscopy, Auger electron spectroscopy and secondary-ion mass spectrometry sputter dept profiling using single and multi-layer thin films
Edition
2022-04-13
ISO 17109
Surface chemical analysis - Depth profiling - Method for sputter rate determination in X-ray photoelectron spectroscopy, Auger electron spectroscopy and secondary-ion mass spectrometry sputter depth profiling using single and multi-layer thin films
Edition
2022-03
IPC HM-860
Specification for Multilayer Hybrid Circuits
Edition
1987-01
IPC D-859
Design Standard for Thick Film Multilayer Hybrid Circuits
Edition
1989-12-01
JIS C 5014
Multilayer printed wiring boards
Edition
1994-02-28
IPC 4101EW1 ; IPC-4101E:2020-04-01 ; IPC-4101E-WAM1:2020-04-01
Specification for Base Materials for Rigid and Multilayer Printed Boards
Edition
2020-04-01
IPC ML-960
Qualification and Performance Specification for Mass Lamination Panels for Multilayer printed Boards
Edition
1994-07-01
IPC 4121
Guidelines for Selecting Core Constructions for Multilayer Printed Wiring Board Applications
Edition
2000-01-01
IPC 4811
Specification for Embedded Passive Device Resistor Materials for Rigid and Multilayer Printed Boards
Edition
2008-05-30
IPC 4821
Specification for Embedded Passive Device Capacitor Materials for Rigid and Multilayer Printed Boards
Edition
2006-06-12
