Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling (IEC 61189-3-719:2016) (german version)
Edition 2017-01-01

Connectors for electronic equipment - Part 4-115: Printed board connectors - Backplane connector for InfiniBand equipment (IEC 61076-4-115:2003); German version EN 61076-4-115:2003
Edition 2004-02

Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling (IEC 60749-25:2003); German version EN 60749-25:2003
Edition 2004-04

Space product assurance - The manual soldering of high-reliability electrical connections; German version EN 50390:2004
Edition 2005-02

Printed boards and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA) (IEC 61188-5-8:2007); German version EN 61188-5-8:2008
Edition 2008-07

Connectors for electronic equipment - Tests and measurements - Part 25-7: Test 25g - Impedance, reflection coefficient and standing voltage wave ratio (VSWR) (IEC 60512-25-7:2004); German version EN 60512-25-7:2005
Edition 2005-12

Semiconductor devices - Constant current electromigration test (IEC 62415:2010); German version EN 62415:2010
Edition 2010-12

Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer (IEC 60749-37:2022); German version EN IEC 60749-37:2022
Edition 2023-12

Optical circuit boards - Part 2-1: Measurements - Optical attenuation and isolation (IEC 62496-2-1:2011); German version EN 62496-2-1:2011
Edition 2012-06

Circuit boards and circuit board assemblies - Design and use - Part 6-3: Land pattern design - Description of land pattern for through hole components (THT) (IEC 91/1700/CD:2021); Text in German and English
Edition 2022-04