Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions (IEC 62047-1:2016); German version EN 62047-1:2016
Edition 2016-12

Semiconductor devices - Constant current electromigration test (IEC 62415:2010); German version EN 62415:2010
Edition 2010-12

Optical circuit boards - Part 2-1: Measurements - Optical attenuation and isolation (IEC 62496-2-1:2011); German version EN 62496-2-1:2011
Edition 2012-06

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling (IEC 61189-3-719:2016) (german version)
Edition 2017-01-01

Semiconductor devices - Metallization stress void test (IEC 62418:2010); German version EN 62418:2010
Edition 2010-12

Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 2: Measurement of radiated emissions - TEM cell and wideband TEM cell method (IEC 61967-2:2005); German version EN 61967-2:2005
Edition 2006-03

Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer (IEC 60749-37:2022); German version EN IEC 60749-37:2022
Edition 2023-12

Space product assurance - The manual soldering of high-reliability electrical connections; German version EN 50390:2004
Edition 2005-02

Printed boards - Part 1: Generic specification (IEC 62326-1:2002); German version EN 62326-1:2002
Edition 2002-12

Device embedding assembly technology - Part 1: Generic specification for device embedded substrates (IEC 62878-1:2019); German version EN IEC 62878-1:2019
Edition 2021-10