Non-destructive testing - Qualification of NDT personnel in Civil Engineering (NDT-CE)
Edition 2022-09

Inductive components - Reliability management (IEC 62211:2017); German version EN 62211:2017
Edition 2017-10

Quality assessment systems - Part 1: Registration and analysis of defects on printed board assemblies (IEC 61193-1:2001); German version EN 61193-1:2002
Edition 2002-07

Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages (IEC 60191-4:2013 + A1:2018); German version EN 60191-4:2014 + A1:2018
Edition 2019-02

Connectors for electronic equipment - Part 4-115: Printed board connectors - Backplane connector for InfiniBand equipment (IEC 61076-4-115:2003); German version EN 61076-4-115:2003
Edition 2004-02

Filters using waveguide type dielectric resonators - Part 2: Guidance for use (IEC 61337-2:2004); German version EN 61337-2:2004
Edition 2005-03

Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat (IEC 60749-20-1:2009); German version EN 60749-20-1:2009
Edition 2009-10

Circuit boards and circuit board assemblies - Design and use - Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards (IEC 61188-6-1:2021); German version EN IEC 61188-6-1:2021
Edition 2022-08

Printed boards - Part 1: Generic specification (IEC 62326-1:2002); German version EN 62326-1:2002
Edition 2002-12

Soft soldering fluxes - Test methods - Part 17: Surface insulation resistance comb test and electrochemical migration test of flux residues (ISO 9455-17:2024); German version EN ISO 9455-17:2024
Edition 2024-04