Connectors for electronic equipment - Part 4-115: Printed board connectors - Backplane connector for InfiniBand equipment (IEC 61076-4-115:2003); German version EN 61076-4-115:2003
Edition 2004-02

Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling (IEC 60749-25:2003); German version EN 60749-25:2003
Edition 2004-04

Semiconductor devices - Constant current electromigration test (IEC 62415:2010); German version EN 62415:2010
Edition 2010-12

Connectors for electronic equipment - Tests and measurements - Part 23-4: Screening and filtering tests; Test 23d: Transmission line reflections in the time domain (IEC 60512-23-4:2001); German version EN 60512-23-4:2001
Edition 2002-07

Space product assurance - The manual soldering of high-reliability electrical connections; German version EN 50390:2004
Edition 2005-02

Optical circuit boards - Part 2-1: Measurements - Optical attenuation and isolation (IEC 62496-2-1:2011); German version EN 62496-2-1:2011
Edition 2012-06

Printed boards and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA) (IEC 61188-5-8:2007); German version EN 61188-5-8:2008
Edition 2008-07

Connectors for electronic equipment - Tests and measurements - Part 25-7: Test 25g - Impedance, reflection coefficient and standing voltage wave ratio (VSWR) (IEC 60512-25-7:2004); German version EN 60512-25-7:2005
Edition 2005-12

Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer (IEC 60749-37:2022); German version EN IEC 60749-37:2022
Edition 2023-12

Semiconductor devices - Metallization stress void test (IEC 62418:2010); German version EN 62418:2010
Edition 2010-12