Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA) (IEC 60191-6-4:2003)
Edition 2004-02-01

Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device package - Design guide for fine-pitch ball grid array (FBGA) (IEC 47D/781/CDV)
Edition 2010-11-01

Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA) (IEC 60191-6-5:2001)
Edition 2002-07-01

Mechanical standardization of semiconductor devices - Part 6-11: General design guidelines for rectangular Fine Pitch Ball Grid Array Packages (FBGA) (IEC 47D/482/CDV)
Edition 2002-03-01

Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA) (IEC 60191-6-17:2011) (german version)
Edition 2011-10-01

Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA) (IEC 60691-6-18:2010) (german version)
Edition 2010-10-01

Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA) (IEC 60191-6-22:2012) (german version)
Edition 2013-10-01

Fibre optic active components and devices - Package and interface standards - Part 21: Design guidelines of electrical interface of PIC packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA) ((IEC 62148-21:2021) EN IEC 62148-21:2021) (german version)
Edition 2022-11-01

Electrical relays - Tests and measurements - Part 56: Ball pressure test (IEC 94/967/CDV) (english version)
Edition 2023-12-15

Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA) (IEC 60191-6-13:2016) (german version)
Edition 2017-07-01