Standard Test Structures for Reliability Assessment of AICu Metallizations with Barrier Materials
Edition 2001-07

Constant-Temperature Aging Method to Characterize Copper Interconnect Metallization for Stress-Induced Voiding
Edition 2017-08

Semiconductor devices - Metallization stress void test (IEC 62418:2010); German version EN 62418:2010
Edition 2010-12

Generic specification: Monolithic integrated circuits; German version EN 190000:1995
Edition 1996-05

Semiconductor devices - Constant current electromigration test (IEC 62415:2010); German version EN 62415:2010
Edition 2010-12

Plain bearings - Requirements and guidance on backings for thick-walled multilayer bearings (ISO 6280:2018)
Edition 2020-04

Connectors for electronic equipment - Tests and measurements - Part 12-3: Soldering tests - Test 12c: Solderability, de-wetting (IEC 60512-12-3:2006); German version EN 60512-12-3:2006, Corrigendum to DIN EN 60512-12-3:2006-11; German version CENELEC-Cor.:2006 to EN 60512-12-3:2006
Edition 2008-11

Connectors for electronic equipment - Tests and measurements - Part 12-1: Soldering tests - Test 12a: Solderability, wetting, solder bath method (IEC 60512-12-1:2006); German version EN 60512-12-1:2006
Edition 2006-11

Space product assurance - Generic procurement requirements for hybrids; English version EN 16602-60-05:2014
Edition 2014-12

Connectors for electronic equipment - Tests and measurements - Part 12-3: Soldering tests - Test 12c: Solderability, de-wetting (IEC 60512-12-3:2006); German version EN 60512-12-3:2006
Edition 2006-11