Semiconductor devices - Part 16-6: Microwave integrated circuits - Frequency multipliers (IEC 60747-16-6:2019); German version EN IEC 60747-16-6:2019
Edition 2021-08

Piezoelectric sensors - Part 1: Generic specifications (IEC 63041-1:2021); German version EN IEC 63041-1:2021
Edition 2023-02

Semiconductor devices - Micro-electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin films (IEC 62047-17:2015); German version EN 62047-17:2015
Edition 2015-12

Methods of test for screed materials - Part 6: Determination of surface hardness; German version EN 13892-6:2002
Edition 2003-02

Semiconductor devices - Part 16-4: Microwave integrated circuits - Switches (IEC 60747-16-4:2004 + A1:2009 + A2:2017); German version EN 60747-16-4:2004 + A1:2011 + A2:2017
Edition 2018-04

Semiconductor devices - Part 16-5: Microwave integrated circuits - Oscillators (IEC 60747-16-5:2013 + A1:2020 + COR1:2020); German version EN 60747-16-5:2013 + A1:2020
Edition 2021-08

Sustainability of construction works - Data quality for environmental assessment of products and construction work - Selection and use of data; German version EN 15941:2024
Edition 2024-10

Semiconductor devices - Part 16-8: Microwave integrated circuits - Limiters (IEC 60747-16-8:2022); German version EN IEC 60747-16-8:2023
Edition 2024-04

Semiconductor devices - Part 16-10: Technology Approval Schedule (TAS) for monolithic microwave integrated circuits (IEC 60747-16-10:2004); German version EN 60747-16-10:2004
Edition 2005-03

Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components (IEC 61188-5-2:2003); German version EN 61188-5-2:2003
Edition 2004-05