Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies (Endorsed by Asociación Española de Normalización in October of 2017.)
Edition 2017-10-01

Fixed resistors for use in electronic equipment. Blank detail specification: Power resistors with axial leads for through-hole assembly on circuit boards (THT), for general electronic equipment, classification level G
Edition 2024-01-19

Fixed resistors for use in electronic equipment. Blank detail specification: Low-power film resistors with leads for through-hole assembly on circuit boards (THT), for general electronic equipment, classification level G
Edition 2023-02-24

Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices (Endorsed by Asociación Española de Normalización in November of 2020.)
Edition 2020-11-01

Surface mounting technology - Part 3: Standard method for the specification of components for through-hole reflow (THR) soldering (Endorsed by Asociación Española de Normalización in April of 2021.)
Edition 2021-04-01

Surface mounting technology. Standard method for the specification of components for through hole reflow (THR) soldering. Guidelines for through hole diameter design with solder paste surface printing method
Edition 2022-09-30

Ceramic Dielectric Capacitors Classes I, II, III and IV - Part III: Detail Specification Sheets - Section 4: Radial Through-Hole Capacitor, Conformally Coated and Molded Types
Edition 2009-03

Miniature fuses - Part 4: Universal modular fuse-links (UMF) - Through-hole and surface mount types
Edition 2006-03-15

Fixed resistors for use in electronic equipment. Sectional specification: Power resistors for through hole assembly on circuit boards (THT) or for assembly on chassis
Edition 2023-02-02

Circuit boards and circuit board assemblies - Design and use - Part 6-3: Land pattern design - Description of land pattern for through hole components (THT)