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UNE-EN 61191-3
Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies (Endorsed by Asociación Española de Normalización in October of 2017.)
Edition
2017-10-01
BS IEC 60115-4-10
Fixed resistors for use in electronic equipment. Blank detail specification: Power resistors with axial leads for through-hole assembly on circuit boards (THT), for general electronic equipment, classification level G
Edition
2024-01-19
BS IEC 60115-2-10
Fixed resistors for use in electronic equipment. Blank detail specification: Low-power film resistors with leads for through-hole assembly on circuit boards (THT), for general electronic equipment, classification level G
Edition
2023-02-24
UNE-EN IEC 60749-15
Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices (Endorsed by Asociación Española de Normalización in November of 2020.)
Edition
2020-11-01
UNE-EN IEC 61760-3
Surface mounting technology - Part 3: Standard method for the specification of components for through-hole reflow (THR) soldering (Endorsed by Asociación Española de Normalización in April of 2021.)
Edition
2021-04-01
PD IEC/TR 61760-3-1
Surface mounting technology. Standard method for the specification of components for through hole reflow (THR) soldering. Guidelines for through hole diameter design with solder paste surface printing method
Edition
2022-09-30
EIA-198-3-4-F
Ceramic Dielectric Capacitors Classes I, II, III and IV - Part III: Detail Specification Sheets - Section 4: Radial Through-Hole Capacitor, Conformally Coated and Molded Types
Edition
2009-03
UNE-EN 60127-4 ERRATUM
Miniature fuses - Part 4: Universal modular fuse-links (UMF) - Through-hole and surface mount types
Edition
2006-03-15
BS IEC 60115-4
Fixed resistors for use in electronic equipment. Sectional specification: Power resistors for through hole assembly on circuit boards (THT) or for assembly on chassis
Edition
2023-02-02
PR NF C93-711-6-3 ; PR NF EN IEC 61188-6-3
Circuit boards and circuit board assemblies - Design and use - Part 6-3: Land pattern design - Description of land pattern for through hole components (THT)