We use cookies to make our website more user-friendly and to continually improve it. Please agree to the use of cookies in order to proceed with using our websites. More information can be found in our data protection information and our cookie guidelines.

- Required
- Functional
- Personalization
- Required
  These cookies are essential for the operation of the site and enable, for example, security-relevant functions. In addition, we can also use this type of cookie to determine whether you want to remain logged in to your profile in order to make our services available to you more quickly when you visit our website again.
- Functional
  In order to further improve our offer and our website, we collect anonymized data for statistics and analysis. With the help of these cookies we can, for example, determine the number of visitors and the effect of certain pages on our website and optimize our content.
- Personalization
  We use these cookies to make it easier for you to use the site. For example, based on a previous (e.g. product search), you can conveniently access it when you visit our website again.

Attention: Your browser doesn't support javascript or you have deactivated Javascript in your browser. Please enable Javascript in your browser in order to be able to use all functions of this website.

NA 062

DIN Standards Committee Materials Testing

About NMP Projects Drafts Publications Documents withdrawn without replacement National committees European committees International committees

Standards [CURRENT]

DIN 50003
Adhesive bondings in electronic applications - Determination of thermal conductivity of materials for heat dissipation

Title (German)

Klebungen in elektronischen Anwendungen - Bestimmung der Wärmeleitfähigkeit von Materialien zur Wärmeableitung

Responsible national committee

NA 062-10-03 AA - Adhesive bondings in electronic applications

Edition 2024-06

Original language German

Price from 49.20 €

Order from DIN Media

Table of contents

PDF (DE)

Contact

Dr.

Nicole Kroll

Am DIN-Platz, Burggrafenstr. 6
10787 Berlin

Tel.: +49 30 2601-2028
Fax: +49 30 2601-42028

Send message to contact

Economic benefits

DIN SPEC

Why do standards cost money?

Get involved in standardization

Terminology

DIN Standards Committee Materials Testing

DIN 50003 Adhesive bondings in electronic applications - Determination of thermal conductivity of materials for heat dissipation

Responsible national committee

Nicole Kroll

DIN 50003
Adhesive bondings in electronic applications - Determination of thermal conductivity of materials for heat dissipation