NA 062
DIN Standards Committee Materials Testing
Draft standard
[Withdrawn]
DIN 50003
DIN 50003
Adhesive bondings in electronic applications - Determination of thermal conductivity of materials for heat dissipation
Title (German)
Klebungen in elektronischen Anwendungen - Bestimmung der Wärmeleitfähigkeit von Materialien zur Wärmeableitung
Responsible national committee
NA 062-10-03 AA - Adhesive bondings in electronic applications
