NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN 62258-6 [CURRENT] references following documents:
| Document number | Edition | Title |
|---|---|---|
| EIA JESD 51 | 1995-12 | Methodology for the Thermal Measurement of Component Packages (Single Semiconductor Device) More |
| EIA JESD 51-1 | 1995-12 | Integrated Circuit Thermal Measurement Method - Electrical Test Method (Single Semiconductor Device) More |
| EIA JESD 51-5 | 1999-02 | Extension of Thermal Test Board Standards for Packages with Direct Thermal Attachment Mechanisms More |
| EIA JESD 51-6 | 1999-03 | Integrated Circuit Thermal Test Method Environmental Conditions - Forced Convection (Moving Air) More |
| EIA JESD 51-8 | 1999-10 | Integrated Circuit Thermal Test Method Environmental Conditions - Junction-to-Board More |
| EIA JESD 51-9 | 2000-07 | Test Boards for Area Array Surface Mount Package Thermal Measurements More |
