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DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE

About DKE Projects Drafts Publications Documents withdrawn without replacement National committees European committees International committees

Standards [CURRENT]

IEC 61189-5
Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies

Title (German)

Prüfverfahren für Elektromaterialien, Verbindungsstrukturen und Baugruppen - Teil 5: Prüfverfahren für bestückte Leiterplatten

Edition 2006-08

Original language English , French

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DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE

IEC 61189-5 Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies

IEC 61189-5
Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies