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DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE

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Standards [CURRENT]

IEC 62047-2
Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials

Title (German)

Halbleiterbauelemente - Bauteile der Mikrosystemtechnik - Teil 2: Prüfverfahren zur Zugbeanspruchung bei Dünnschicht-Werkstoffen

Edition 2006-08

Original language English , French

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Table of contents

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Terminology

DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE

IEC 62047-2 Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials

IEC 62047-2
Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials