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DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE

About DKE Projects Drafts Publications Documents withdrawn without replacement National committees European committees International committees

Standards [CURRENT]

IEC 60749-35
Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy for plastic encapsulated electronic components

Title (German)

Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 35: Ultraschallmikroskopie für kunststoffverkappte Bauelemente der Elektronik

Edition 2006-07

Original language English , French

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Table of contents

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Terminology

DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE

IEC 60749-35 Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy for plastic encapsulated electronic components

IEC 60749-35
Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy for plastic encapsulated electronic components