NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN 61360-4 [CURRENT] references following documents:
| Document number | Edition | Title |
|---|---|---|
| IEC 60050-702 | 1992-03 | International electrotechnical vocabulary; chapter 702: oscillations, signals and related devices More |
| ES 59008-1 | 1999-09 | Data requirements for semiconductor die - Part 1: General requirements More |
| ES 59008-2 | 1999-09 | Data requirements for semiconductor die - Part 2: Vocabulary More |
| ES 59008-3 | 1999-09 | Data requirements for semiconductor die - Part 3: Mechanical, material and connectivity requirements More |
| ES 59008-4-1 | 2000-09 | Data requirements for semiconductor die - Part 4-1: Specific requirements and recommendations; Test and quality More |
| ES 59008-4-2 | 2000-09 | Data requirements for semiconductor die - Part 4-2: Specific requirements and recommendations; Handling and storage More |
| ES 59008-4-3 | 1999-11 | Data requirements for semiconductor die - Part 4-3: Specific requirements and recommendations - Thermal More |
| ES 59008-4-4 | 1999-11 | Data requirements for semiconductor die - Part 4-4: Specific requirements and recommendations - Electrical simulation More |
| ES 59008-5-1 | 2001-03 | Data requirements for semiconductor die - Part 5-1: Particular requirements and recommendations for die types; Bare die More |
| ES 59008-5-2 | 2001-03 | Data requirements for semiconductor die - Part 5-2: Particular requirements and recommendations for die types; Bare die with added connection structures More |
