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NA 022

DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE

About DKE Projects Drafts Publications Documents withdrawn without replacement National committees European committees International committees

Standards [CURRENT]

IEC 60749-22 Corrigendum 1
Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength

Title (German)

Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 22: Kontaktfestigkeit

Edition 2003-08

Original language English , French

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DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE

IEC 60749-22 Corrigendum 1 Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength

IEC 60749-22 Corrigendum 1
Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength