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DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE

About DKE Projects Drafts Publications Documents withdrawn without replacement National committees European committees International committees

Standards [CURRENT]

IEC 60191-6-2 Corrigendum 1
Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages

Title (German)

Mechanische Normung von Halbleiterbauelementen - Teil 6-2: Allgemeine Regeln für die Erstellung von Gehäusezeichnungen von SMD-Halbleitergehäusen; Konstruktionsleitfaden für Gehäuse mit Kugel- und Säulenanschlüssen in einem Raster von 1,50 mm, 1,27 mm und 1,00 mm

Edition 2002-10

Original language English , French

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Table of contents

Economic benefits

DIN SPEC

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Terminology

DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE

IEC 60191-6-2 Corrigendum 1 Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages

IEC 60191-6-2 Corrigendum 1
Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages