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NA 022

DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE

About DKE Projects Drafts Publications Documents withdrawn without replacement National committees European committees International committees

Standards [CURRENT]

DIN EN 60191-6-4
Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA) (IEC 60191-6-4:2003); German version EN 60191-6-4:2003

Title (German)

Mechanische Normung von Halbleiterbauelementen - Teil 6-4: Allgemeine Regeln für die Erstellung von Gehäusezeichnungen von SMD-Halbleitergehäusen; Messverfahren für Gehäusemaße von Ball Grid Array (BGA) (IEC 60191-6-4:2003); Deutsche Fassung EN 60191-6-4:2003

Document: references other documents

Document: referenced in other documents

Responsible national committee

DKE/UK 631.4 - Gehäuse für Halbleiterbauelemente

Responsible international committee

IEC/SC 47D - Mechanical standardization for semiconductor devices

Edition 2004-01

Original language German

Price from 91.80 €

Order from DIN Media

Table of contents

Contact

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Konstantin Petridis

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63069 Offenbach am Main

Tel.: +49 69 6308-443

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