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NA 022

DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE

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Standards [CURRENT]

DIN EN 60749-22
Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength (IEC 60749-22:200 + Corr. 1:2003); German version EN 60749-22:2003

Title (German)

Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 22: Kontaktfestigkeit (Bond-Strength) (IEC 60749-22:2002 + Corr. 1:2003); Deutsche Fassung EN 60749-22:2003

Responsible national committee

DKE/K 631 - Halbleiterbauelemente  

Responsible international committee

IEC/TC 47 - Semiconductor devices  

Edition 2003-12
Original language German
Price from 91.80 €
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Table of contents

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