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DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE

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Standards [Withdrawn]

DIN EN 60749-20
Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat (IEC 60749-20:2002 + Corr. 1:2003); German version EN 60749-20:2003

Title (German)

Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 20: Beständigkeit kunststoffverkappter oberflächenmontierbarer Bauelemente (SMD) gegenüber der kombinierten Beanspruchung von Feuchte und Lötwärme (IEC 60749-20:2002 + Corr. 1:2003); Deutsche Fassung EN 60749-20:2003

Document: references other documents

Responsible national committee

DKE/K 631 - Halbleiterbauelemente  

Responsible international committee

IEC/TC 47 - Semiconductor devices  

Edition 2003-12
Original language German
Price from 99.10 €
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Table of contents

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