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NA 022

DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE

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Standards [Withdrawn]

DIN EN 60749-19
Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength (IEC 60749-19:2003); German version EN 60749-19:2003 + Corrigendum 2003-06

Title (German)

Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 19: Prüfung der Chip-Bondfestigkeit (IEC 60749-19:2003); Deutsche Fassung EN 60749-19:2003 + Corrigendum 2003-06

Document: referenced in other documents

Responsible national committee

DKE/K 631 - Halbleiterbauelemente  

Responsible international committee

IEC/TC 47 - Semiconductor devices  

Edition 2003-10
Original language German
Price from 42.10 €
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