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DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE

About DKE Projects Drafts Publications Documents withdrawn without replacement National committees European committees International committees

Standards [CURRENT]

IEC 60191-6-4
Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)

Title (German)

Mechanische Normung von Halbleiterbauelementen - Teil 6-4: Allgemeine Regeln für die Erstellung von Gehäusezeichnungen von SMD-Halbleitergehäusen - Messverfahren für Gehäusemaße von Ball Grid Array (BGA)

Edition 2003-06

Original language English , French

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Table of contents

Economic benefits

DIN SPEC

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Terminology

DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE

IEC 60191-6-4 Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)

IEC 60191-6-4
Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)