NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN 62326-1 [CURRENT] references following documents:
Document number | Edition | Title |
---|---|---|
EN 62326-1 | 2002-06 | Printed boards - Part 1: Generic specification (IEC 62326-1:2002) More |
EN 62326-4 | 1997-01 | Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification (IEC 62326-4:1996) More |
EN 62326-4-1 | 1997-01 | Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification - Section 1: Capability detail specification - Performance levels A, B and C (IEC 62326-4-1:1996) More |
IEC 61182-1 | 1994-08 | Printed boards - Electronic data description and transfer - Part 1: Printed board description in digital form More |
IEC 61249-2-12 | 1999-01 | Materials for printed boards and other interconnecting structures - Part 2-12: Sectional specification set for reinforced base materials, clad and unclad - Epoxide non-woven aramid laminate of defined flammability, copper-clad More |
IEC 61249-2-4 | 2001-12 | Materials for printed boards and other interconnection structures - Part 2-4: Reinforced base materials, clad and unclad; Polyester non-woven/woven fibreglass laminated sheet of defined flammability (vertical burning test), copper-clad More |
IEC 61249-2-7 | 2002-03 | Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials clad and unclad; Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad More |
IEC 62326-1 ; QC 230000:2002-03 | 2002-03 | Printed boards - Part 1: Generic specification More |
IEC 62326-4 ; QC 230500:1996-12 | 1996-12 | Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification More |
IEC 62326-4-1 ; QC 230401:1996-12 | 1996-12 | Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification - Section 1: Capability detail specification - Performance levels A, B and C More |